MediaTek and AMD have just announced a collaboration to co-engineer the AMD RZ600 series Wi-Fi 6E modules with MediaTek’s new Filogic 330P chipset.
The Filogic 330P chipset will power next-generation AMD Ryzen-series laptops and desktop PCs in the following years.
To optimize the AMD RZ600 series Wi-Fi 6E modules, both companies developed and certified PCIe and USB interfaces for modern sleep states and power management. Furthermore, the optimization process included stress testing and ensuring compatibility standards.
| Wi-Fi Module | Wi-Fi Specs | M.2 Slots |
|---|---|---|
| AMD RZ616 Wi-Fi 6E module | Wi-Fi 6E 2×2 160MHz Wi-Fi Channels PHY rate up to 2.4Gbps | M.2 2230 and 1216 |
| AMD RZ608 Wi-Fi 6E module | Wi-Fi 6E 2×2 80MHz Wi-Fi Channels PHY rate up to 1.2Gbps | M.2 2230 |
“MediaTek is already the Wi-Fi leader in a number of different segments, including smart TVs, routers, and voice assistants. The new Filogic 330P chipset further broadens our connectivity portfolio as we continue to expand our footprint in the PC market. With this high throughput and ultra-low power chipset powering the next generation of AMD laptops, consumers can enjoy seamless connectivity and longer battery life while they game, stream, and video chat.”
Alan Hsu, Corporate Vice President and General Manager, Intelligent Connectivity at MediaTek
Filogic 330P supports 2×2 Wi-Fi 6 and 6E as well as Bluetooth 5.2. Additionally, it supports up to 2.4Gbps connectivity and the new 6Hz spectrum at 160MHz channel. The new chipset from MediaTek also integrates MediaTek’s power amplifier and low noise amplifier to help optimize power consumption and reduce design footprint.
To learn more about the MediaTek Filogic series, click here.
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Source: Gadget Pilipinas
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