The rumor mill is churning for Samsung‘s next foldable phones, the Galaxy Z Flip FE and Z Flip7. A recent leak sheds light on the chipsets powering these upcoming devices, hinting at a strategic shift for Samsung.
Galaxy Z Flip FE and Z Flip7 Rumors
The Galaxy Z Flip FE, rumored to be a more affordable version of the original Z Flip, is expected to pack an Exynos 2400e processor. This choice aligns with expectations for a budget-friendly phone, as Exynos chips are typically less expensive than Qualcomm’s Snapdragon processors.
Moreover, the Exynos 2400e has proven to be a capable performer in devices like the Galaxy S24 FE, suggesting it can deliver a smooth user experience for the Z Flip FE.
The news gets more interesting with the rumored chipset for the Z Flip7. This foldable flagship is expected to ditch the Snapdragon 8 Gen 3, used in the Z Flip6, and instead adopt an all-new Exynos 2500 processor. This is bold, especially considering rumors of potential issues surrounding the Exynos 2500.
Samsung’s strategy may change, reserving the unproven Exynos 2500 for the Z Flip7, potentially indicating a more confident in-house chip development. However, uncertainties remain, and official confirmation of these chipsets and their performance is yet to be seen. The potential issues surrounding the Exynos 2500 could also influence Samsung’s decision.
Source: Gadget Pilipinas
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